Conductive polishing article for electrochemical mechanical polishing

US6962524B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Paul D. Butterfield · San Jose, US
• Liang-Yuh Chen · San Jose, US
• Yonqi Hu · San Jose, US
• Antoine P. Manens · Palo Alto, US
• Rashid Mavliev · Truckee, US
• Stan Tsai · Clifton Park, US
• Feng Q. Liu · San Jose, US
• Ralph Wadensweiler · Sunnyvale, US
• Lizhong Sun · San Jose, US
• Siew Neo · Sunnyvale, US
• Alain Duboust · Sunnyvale, US

Key dates

• Filing date: Aug 15, 2003
• Grant date: Nov 8, 2005
• Expiry date: Aug 15, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/32125
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.