Process for controlling thin film uniformity and products produced thereby
US6962732B2 · kind B2 · utility
5Cited by
12References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2001 |
| Grant date | Nov 8, 2005 |
| Priority date | — |
| Expiry date | Aug 23, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/26
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Processes for controlling thickness uniformity of thin organosilicate films as they are deposited on a substrate, and as they finally result. During deposition of the film, which may be accomplished by CVD, PECVD, rapid thermal processing or the like, the substrate temperature is controlled to establish a temperature profile particularly suited to the extreme temperature sensitivities of the deposition rates of organosilicate films such as those deposited from TEOS as a source material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.