Methods and apparatus for controlling electrolyte flow for uniform plating
US6964792B1 · kind B1 · utility
73Cited by
22References
58Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2001 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | May 20, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/008
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides apparatus and methods for controlling flow dynamics of a plating fluid during a plating process. The invention achieves this fluid control through use of a diffuser membrane. Plating fluid is pumped through the membrane; the design and characteristics of the membrane provide a uniform flow pattern to the plating fluid exiting the membrane. Thus a work piece, upon which a metal or other conductive material is to be deposited, is exposed to a uniform flow of plating fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.