Apparatus and method of forming a device layer
US6964894B2 · kind B2 · utility
8Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2003 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Jun 23, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/00238
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of forming a MEMS device produces a device layer wafer having a pre-formed conductive pathway before coupling it with a handle wafer. To that end, the method produces the noted device layer wafer by 1) providing a material layer, 2) coupling a conductor to the material layer, and 3) forming at least two conductive paths through at least a portion of the material layer to the conductor. The method then provides the noted handle wafer, and couples the device layer wafer to the handle wafer. The wafers are coupled so that the conductor is contained between the material layer and the handle wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.