System and method for optimizing metrology sampling in APC applications
US6965808B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2004 |
| Grant date | Nov 15, 2005 |
| Priority date | — |
| Expiry date | Apr 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B21/02
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A system and method for optimizing metrology sampling rates in an advanced process control (APC) application. A method is provided for processing a run of workpieces, the method comprising the steps of: providing a database comprising subgroups of data representing characteristics from previously processed workpieces; selecting a first subgroup of data having characteristics that satisfy a predetermined criteria; determining processing conditions for a processing tool corresponding to said first subgroup of data; processing the run of workpieces with the process tool using the determined processing conditions; and measuring the run of workpieces according to a sampling rate determined from the first subgroup of data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.