Integrated endpoint detection system with optical and eddy current monitoring
US6966816B2 · kind B2 · utility
25Cited by
83References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 2, 2001 |
| Grant date | Nov 22, 2005 |
| Priority date | — |
| Expiry date | Jan 14, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0683
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.