Fabrication method of circuit board
US6968613B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2002 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Oct 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fabrication method of a circuit board is proposed, wherein a core layer is formed with a plurality of conductive traces, and photo resist is respectively applied on terminals of the conductive traces. Then, a non-solderable material is applied over the core layer as to cover the conductive traces except for the insulating material, and the non-solderable material is adapted to be surface-flush with the insulating material, allowing the insulating material to be exposed from the non-solderable material. Finally, the insulating material is removed from the core layer to expose the terminals of the conductive traces, wherein the exposed terminals are used as bond pads or bond fingers where solder balls, solder bumps or bonding wires can be bonded. This circuit board is cost-effectively fabricated by simplified processes, and beneficial in precisely exposing bond pads or bond fingers, thereby significantly improving yield of fabricated circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.