Superjunction device and method of manufacture therefor
US6969657B2 · kind B2 · utility
1Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2004 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Mar 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/393
Abstract
A process for forming a superjunction device that includes a series of implants to form closely spaced implant regions which are linked together by a short thermal step, whereby deep and narrow regions can be formed within a semiconductor body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.