Jianjun Cao
63Patents
11h-index
56Co-inventors
81Inventor score
Filing activity: Nov 20, 2000 → Feb 15, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6640144B1 | System and method for creating a controlling device | Physics | 107 | Expired |
| US6785579B2 | System and method for creating a controlling device | Physics | 88 | Expired |
| US6829512B2 | System and method for creating a controlling device | Physics | 87 | Expired |
| US8823012B2 | Enhancement mode GaN HEMT device with gate spacer and method for fabricating the same | Electricity | 27 | Active |
| US7075147B2 | Low on resistance power MOSFET with variably spaced trenches and offset contacts | Electricity | 22 | Expired |
| US8404508B2 | Enhancement mode GaN HEMT device and method for fabricating the same | Electricity | 20 | Active |
| USRE39716E1 | System and method for creating a controlling device | General | 19 | Expired |
| US7161208B2 | Trench mosfet with field relief feature | Electricity | 15 | Expired |
| US8436398B2 | Back diffusion suppression structures | Electricity | 15 | Active |
| US7579650B2 | Termination design for deep source electrode MOSFET | Electricity | 12 | Active |
| US8338861B2 | III-nitride semiconductor device with stepped gate trench and process for its manufacture | Electricity | 12 | Active |
| US8890168B2 | Enhancement mode GaN HEMT device | Electricity | 11 | Active |
| US8350294B2 | Compensated gate MISFET and method for fabricating the same | Electricity | 10 | Active |
| US9607876B2 | Semiconductor devices with back surface isolation | Electricity | 8 | Active |
| US8853749B2 | Ion implanted and self aligned gate structure for GaN transistors | Electricity | 7 | Active |
| US6563197B1 | MOSgated device termination with guard rings under field plate | Electricity | 7 | Expired |
| US9214461B2 | GaN transistors with polysilicon layers for creating additional components | Electricity | 7 | Active |
| US9837438B2 | GaN transistors with polysilicon layers used for creating additional components | Electricity | 6 | Active |
| US10312131B2 | Semiconductor devices with back surface isolation | Electricity | 6 | Active |
| US9171911B2 | Isolation structure in gallium nitride devices and integrated circuits | Electricity | 6 | Active |
| US7679111B2 | Termination structure for a power semiconductor device | Electricity | 6 | Active |
| US6639276B2 | Power MOSFET with ultra-deep base and reduced on resistance | Electricity | 6 | Expired |
| US7482654B2 | MOSgated power semiconductor device with source field electrode | Electricity | 5 | Expired |
| US7619280B2 | Current sense trench type MOSFET with improved accuracy and ESD withstand capability | Electricity | 5 | Expired |
| US7973304B2 | III-nitride semiconductor device | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.