Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same
US6974330B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4921
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of electrical interconnections may be formed in an electrical device including a first component having a plurality of contact pads and a second component having a plurality of contact pads. The two components are placed in a confronting spaced relationship such that each contact pad of the first component locationally corresponds to one of the contact pads of the second component. The contact pads of the second component are further arranged such that at least two of the contact pads are laterally offset relative to their locationally corresponding contact pads on the first component with one of the at least two contact pads being offset in a first direction while the other is offset in another direction. A mass of conductive material is disposed between each contact pad of the first component and its corresponding contact pad of the second component. The masses of conductive material may be formed into columnar members wherein the columnar members are skewed when formed between a pair of relatively offset contact pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.