Apparatus, method and system for monitoring chamber parameters associated with a deposition process
US6974524B1 · kind B1 · utility
2Cited by
19References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Dec 15, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/564
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and methods for measuring characteristics of a metallic target as well as other interior surfaces of a sputtering chamber. The apparatus includes a sensor configured to emit an energy beam toward a surface of interest and to detect an energy beam therefrom, the detected energy beam being indicative of parameters of a characteristic of interest of the surface of interest. Quantitative and qualitative characteristics of interest may be determined. A sputtering system including the apparatus and operable according to the methods of the invention is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.