Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
US6976905B1 · kind B1 · utility
13Cited by
24References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2000 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Feb 21, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method and system for planarizing or polishing a substrate, particularly a memory or rigid disk, are provided. The method comprises abrading at least a portion of the surface with a polishing system comprising (i) a polishing composition comprising water, an oxidizing agent, and about 0.04 M or higher phosphate ion or phosphonate ion, and (ii) abrasive material. The present invention also provides a system for planarizing or polishing a substrate comprising (i) a polishing composition comprising water, an oxidizing agent, and about 0.04 M or higher phosphate ion or phosphonate ion, and (ii) silica particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.