Heat treatment method, heat treatment apparatus and treatment system
US6979474B2 · kind B2 · utility
2Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2001 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | Jun 22, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67178
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
When a substrate coated with a coating solution which oxidizes at high temperatures is heat-treated, an oxygen concentration of a treatment atmosphere is lowered when the temperature is low. Next, the substrate is heat-treated in the treatment atmosphere of which the oxygen concentration is lowered. Sequentially, the treatment atmosphere is returned to that with the original oxygen concentration after the passage of a predetermined time after completing the heat treatment. Thereby, the substrate can be heat-treated, with the oxidization of the coating solution being controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.