Patent · US Expired

Methods and apparatus for determining scrubber brush pressure

US6986185B2 · kind B2 · utility

10Cited by

3References

37Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Michael Sugarman · San Francisco, US
Vladimir Galburt · Campbell, US

Key dates

Filing date	Oct 29, 2002
Grant date	Jan 17, 2006
Priority date	—
Expiry date	Sep 10, 2023

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB08B1/34
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

In a scrubber adapted to clean a semiconductor wafer, the torque of a brush rotation motor is monitored while a scrubber brush is in contact with the wafer and is being rotated by the motor. The position of the brush relative to the wafer may be adjusted based on the monitored torque to regulate the pressure applied to the wafer by the brush. Open loop positioning or closed loop control may be employed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.