Method and apparatus for mounting a heat transfer apparatus upon an electronic component
US6988533B2 · kind B2 · utility
5Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2003 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Jul 7, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat transfer apparatus comprises a thermally conductive member including a base having one or more surfaces adapted to absorb heat from an electronic component, and a mounting assembly including at least one mounting member directly coupled to the base and for direct attachment to the electronic component so that loading forces for mounting on it the electronic component are not directly applied to the base. The thermally conductive member is a graphite-based material. A compliant force applying mechanism is mounted generally on the base for controlling forces applied on the base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.