Surface preparation for receiving processing treatments

US6988936B2 · kind B2 · utility

Assignee

• S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES · FR

Inventors

• Laurent Filipozzi · Saint-Égrève, FR
• Frederic Metral · Voiron, FR

Key dates

• Filing date: Jul 15, 2003
• Grant date: Jan 24, 2006
• Expiry date: Jul 15, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02052
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A solution for rinsing a surface that has been planarized using a chemical-mechanical planarization (“CMP”) technique. The solution may be a surfactant solution introduced following the use of a polishing solution in the CMP technique. The surfactant solution acts to clear undesirable particles from the planarized surface and also can terminate “latent” effects from the polishing solution. A cleaning solution is generally injected after the rinsing solution for additional cleaning effects. A plate covered with a textured material such a fabric is usually applied to the surface during the polishing, rinsing, or cleaning steps.