Process for preparation of semiconductor wafer surface
US6991943B2 · kind B2 · utility
1Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Dec 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for adjusting the resistivity in the surface of a semiconductive substrate including selective measurement and counter-doping of areas on a major surface of a semiconductive substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.