Apparatus and method for die attachment
US6991967B2 · kind B2 · utility
5Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2004 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.