Ran Fu
5Patents
4h-index
11Co-inventors
50Inventor score
Filing activity: Feb 23, 2004 → Jun 2, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6991967B2 | Apparatus and method for die attachment | Electricity | 5 | Expired |
| US7246735B2 | Wire clamping plate | Electricity | 5 | Expired |
| US7462926B2 | Leadframe comprising tin plating or an intermetallic layer formed therefrom | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7458495B2 | Flip chip bonding tool | Electricity | 4 | Expired |
| USD1055973S1 | Display screen or portion thereof with animated graphical user interface | General | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.