Patent · US Expired

Electrostatic chuck and its manufacturing method

US6992876B1 · kind B1 · utility

12Cited by
6References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 8, 1999
Grant dateJan 31, 2006
Priority date
Expiry dateJul 8, 2019

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T279/23
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An electrostatic chuck for preventing warpage of a ceramic layer and cooling gas leakage while providing enhanced electrostatic attraction and an improved detachment performance and its manufacturing method is disclosed. The chuck comprises at least one electrode (90, 91, 92) located in the middle of the ceramic layer (80) in its thickness direction, a cooling gas channel (81) is formed on a surface of the ceramic layer within an outer edge of the electrode and above the electrode, wherein the electrode extends beyond the cooling gas channel. Preferably the electrodes are shaped in the form of two interlocked structures comprising multiple interconnected C-shaped ring portion (91c, 92c).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.