CMP composition containing organic nitro compounds
US6998066B2 · kind B2 · utility
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Key dates
| Filing date | May 7, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Oct 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The use of organic nitro compounds, such as nitrobenzene sulfonic acids, in chemical mechanical polishing compositions is disclosed. Chemical mechanical polishing slurries are widely used in polishing and planarizing silicon wafers and other fine surfaces. Inorganic nitro compounds are widely used in these slurries as oxidant sources. However, organic nitro compounds, particularly aromatic nitro compounds, are here suggested as advantageous substitutes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.