Semiconductor package with passive device integration
US7005325B2 · kind B2 · utility
58Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2004 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Feb 5, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.