Detection of spatially repeating signatures
US7006886B1 · kind B1 · utility
11Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 12, 2004 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jan 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for analyzing defects on a substrate, including inspecting the substrate to detect the defects, identifying the defects by location, analyzing the defects to detect extended objects, and analyzing the extended objects for repetition across the substrate. Thus, the present invention extends beyond the present analysis methods, by analyzing the extended objects for repetition across the substrate. In this manner, correlation with processing problems can be more readily detected, in cases where the individual defects themselves, of which the extended objects are formed, do not appear to have repeating properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.