System and method for a combined contact and non-contact wafer cleaning module
US7007333B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Jun 9, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B1/32
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A system and a method for cleaning and rinsing a wafer includes at least three rollers that are capable of supporting a wafer by an edge of the wafer. At least one of the rollers is driven and thereby capable of rotating the wafer. At least one of the rollers is a movable roller mounted on an actuator. The system and method also includes a first movable scrubbing roller capable of being moved away from and alternatively to the first side of the wafer. A second movable scrubbing roller capable of being moved away from and alternatively to a second side of the wafer is also included. The second side of the wafer opposes the first side of the wafer. The system and method also includes at least one first side nozzle directed toward the first side of the wafer and at least one second side nozzle directed toward the second side of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.