Substrate monitoring during chemical mechanical polishing
US7008295B2 · kind B2 · utility
36Cited by
23References
53Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2003 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Feb 23, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus for monitoring a substrate surface during chemical mechanical polishing are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.