Polishing uniformity via pad conditioning
US7008301B1 · kind B1 · utility
3Cited by
10References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 26, 1999 |
| Grant date | Mar 7, 2006 |
| Priority date | — |
| Expiry date | Jun 16, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
According to an example embodiment, the present invention is directed to a CMP apparatus having a polishing table, a wafer carrier adapted to carry a wafer on a pad, and a conditioning wheel. If the pad is being polished in a center-fast or center-slow manner, the conditioning wheel is used to condition the pad and to improve the center-fast or center-slow condition. Benefits of using this embodiment include improved wafer quality, improved pad life, a reduction in defective wafers, and faster production.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.