Method for manufacturing a housing for a chip with a micromechanical structure

US7011986B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Frank Daeche · Unterhaching, DE
• Hans-Joerg Timme · Ottobrunn, DE

Key dates

• Filing date: Oct 12, 2004
• Grant date: Mar 14, 2006
• Expiry date: Oct 12, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

In a housing manufacturing method a base is provided with first contact elements with a photolithographically patternable layer that is patterned for exposing the contact elements. A chip with a micromechanical structure lying between second contact elements at the chip is provided with a photolithographically patternable layer which is patterned in order to provide a recess in the area of the micromechanical structure and in the area of the second contact elements. After joining the base and the chip the base is removed by etching.