Method of producing an electronic device having a PB free solder connection
US7013564B2 · kind B2 · utility
8Cited by
8References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Oct 9, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12715
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of producing an electronic device by connecting a lead of a semiconductor device with an electrode of a circuit board to form a bonded structure. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.