Concurrent electrical signal wiring optimization for an electronic package
US7017128B2 · kind B2 · utility
5Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2003 |
| Grant date | Mar 21, 2006 |
| Priority date | — |
| Expiry date | Feb 1, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for optimization of a signal wire structure, providing concurrent optimization of a plurality of wire parameters, providing a plurality of wiring solutions, wherein each of said wiring solutions produces a wiring package having different wire parameters, providing an electronic package, determining the optimal wiring solutions for said electronic package; and producing an electronic package, using the optimized wiring package solutions. The resulting apparatus is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.