Method and apparatus for transferring heat from a substrate to a chuck
US7017652B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2003 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Aug 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A chuck method of and apparatus (50, 150, 300) for supporting a substrate (W) during processing of the substrate, where the substrate has a lower surface (WL). The apparatus facilitates heat transfer away from the substrate during processing of the substrate. The apparatus comprises a chuck body (60) having an outer edge (70) and a rough upper surface (64U). The substrate is arranged adjacent the rough surface such that the substrate lower surface and the roughened upper surface form a gap (100) therebetween. The apparatus further includes a central gas conduit (80) passing through the chuck body. The central conduit has a second end (82b) open to the roughened upper surface and a first end opposite the second end connected to a gas source (86). The conduit is arranged such that a gas can flow through the conduit into the gap and toward the chuck body outer edge. The gas used has an atomic or molecular weight that is greater than that of helium. The surface roughness, the substrate lower surface and the flow of the heavier gas in the gap contribute to defining an accommodation coefficient α and a mean free path λ such that the ratio α/λ is higher than that of prior art apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.