Method of uniformly coating a substrate
US7018943B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2001 |
| Grant date | Mar 28, 2006 |
| Priority date | — |
| Expiry date | Feb 23, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D1/265
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.