Tom Zhong
58Patents
16h-index
49Co-inventors
84Inventor score
Filing activity: Dec 29, 1998 → Jul 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7045368B2 | MRAM cell structure and method of fabrication | Electricity | 117 | Expired |
| US7476919B2 | MRAM cell structure and method of fabrication | Electricity | 98 | Active |
| US7863060B2 | Method of double patterning and etching magnetic tunnel junction structures for spin-transfer torque MRAM devices | Electricity | 81 | Active |
| US8722543B2 | Composite hard mask with upper sacrificial dielectric layer for the patterning and etching of nanometer size MRAM devices | Emerging Cross-Sectional Technologies | 75 | Active |
| US7936027B2 | Method of MRAM fabrication with zero electrical shorting | Electricity | 74 | Active |
| US8105948B2 | Use of CMP to contact a MTJ structure without forming a via | Electricity | 37 | Active |
| US8772051B1 | Fabrication method for embedded magnetic memory | Electricity | 31 | Active |
| US8324698B2 | High density spin-transfer torque MRAM process | Electricity | 28 | Active |
| US10069064B1 | Memory structure having a magnetic tunnel junction (MTJ) self-aligned to a T-shaped bottom electrode, and method of manufacturing the same | Electricity | 26 | Active |
| US7884433B2 | High density spin-transfer torque MRAM process | Electricity | 22 | Active |
| US6254936A | Environment exchange control for material on a wafer surface | Physics | 22 | Expired |
| US6327793A | Method for two dimensional adaptive process control of critical dimensions during spin coating process | Performing Operations; Transporting | 21 | Expired |
| US8183061B2 | High density spin-transfer torque MRAM process | Electricity | 21 | Active |
| US7122386B1 | Method of fabricating contact pad for magnetic random access memory | Electricity | 19 | Expired |
| US8133745B2 | Method of magnetic tunneling layer processes for spin-transfer torque MRAM | Electricity | 19 | Active |
| US6662466B2 | Method for two dimensional adaptive process control of critical dimensions during spin coating process | Performing Operations; Transporting | 16 | Expired |
| US6977098B2 | Method of uniformly coating a substrate | Performing Operations; Transporting | 15 | Expired |
| US6468586B1 | Environment exchange control for material on a wafer surface | Physics | 14 | Expired |
| US6780461B2 | Environment exchange control for material on a wafer surface | Physics | 13 | Expired |
| US8803293B2 | Method to reduce magnetic film stress for better yield | Electricity | 12 | Active |
| US8933542B2 | Method to reduce magnetic film stress for better yield | Electricity | 12 | Active |
| US9608200B2 | Hybrid metallic hard mask stack for MTJ etching | Electricity | 10 | Active |
| US9972777B1 | MTJ device process/integration method with pre-patterned seed layer | Electricity | 7 | Active |
| US7508700B2 | Method of magnetic tunneling junction pattern layout for magnetic random access memory | Emerging Cross-Sectional Technologies | 7 | Active |
| US6844027B1 | Environment exchange control for material on a wafer surface | Physics | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.