Method of polishing a substrate with a polishing system containing conducting polymer
US7021993B2 · kind B2 · utility
2Cited by
21References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2002 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Jan 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a method of polishing a substrate comprising (i) contacting a substrate with a polishing system comprising (a) an abrasive, a polishing pad, a means for oxidizing a substrate, or any combination thereof, (b) a conducting polymer having an electrical conductivity of about 10−10 S/cm to about 106 S/cm, and (c) a liquid carrier, and (ii) abrading or removing at least a portion of the substrate to polish the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.