FBGA arrangement

US7023097B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Jochen Thomas · Munich, DE
• Juergen Grafe · Dresden, DE
• Ingo Wennemuth · Munich, DE
• Minka Gospodinova-Daltcheva · Munich, DE
• Maksim Kuzmenka · Birkenfeld, DE

Key dates

• Filing date: Aug 27, 2004
• Grant date: Apr 4, 2006
• Expiry date: Aug 27, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/30107
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to an FBGA arrangement, comprising a substrate on which at least one chip is chip-bonded face-down, which has a central row of bonding pads connected to contact islands (landing pads) on the substrate by a bonding channel in the substrate via wire bridges, which substrate, for its part, is provided with soldering balls—arranged in an array—for contact connection to a printed circuit board, and the contact islands and the soldering balls being connected to one another via a rewiring of the substrate. The preferred embodiment of the invention is intended to provide an FBGA arrangement which supports the center pad row technology and at the same time has low electrical parasitics. This is achieved by virtue of the fact that at least two substrates (1, 2) are provided, the substrates (1, 2) are provided substratewise in each case with bonding channels (3, 4) having different dimensions, in a manner forming a multistage bonding channel, the bonding channels (3) in the ball-side substrate (2) having larger dimensions than those in the chip-side substrate (1).