Patent · US Expired

Device for cooling memory modules

US7023701B2 · kind B2 · utility

73Cited by

15References

7Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Christian Stocken · Munich, DE
Stephan Schröder · Birkenfeld, DE
Thomas Huber · Schliersee, DE
Manfred Proll · Dorfen, DE

Key dates

Filing date	Apr 22, 2004
Grant date	Apr 4, 2006
Priority date	—
Expiry date	Apr 23, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for cooling memory modules can include a plurality of elements. The elements can thermal couple at least two memory modules. The device can further include a body or a plurality of contact areas bearing in a planar manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.