Substrate heater assembly
US7024105B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Oct 10, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68735
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate heater assembly for supporting a substrate of a predetermined standardized diameter during processing is provided. In one embodiment, the substrate heater assembly includes a body having an upper surface, a lower surface and an embedded heating element. A substrate support surface is formed in the upper surface of the body and defines a portion of a substrate receiving pocket. An annular wall is oriented perpendicular to the upper surface and has a length of at least one half a thickness of the substrate. The wall bounds an outer perimeter of the substrate receiving pocket and has a diameter less than about 0.5 mm greater than the predetermined substrate diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.