Pad assembly for electrochemical mechanical processing
US7029365B2 · kind B2 · utility
14Cited by
213References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Mar 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32125
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.