Angular spin, rinse, and dry module and methods for making and implementing the same
US7029539B2 · kind B2 · utility
0Cited by
13References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Apr 30, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for processing a wafer in a spin, rinse, and dry (SRD) module is provided. The method includes engaging a wafer in a process plane, spinning the wafer in the process plane, and cleaning a top surface and a bottom surface of the wafer while spinning the wafer in the process plane. The process plane is configured to define a process angle with a horizontal plane. The process angle is configured to optimize the performance of the SRD module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.