High density chip carrier with integrated passive devices
US7030481B2 · kind B2 · utility
320Cited by
12References
52Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 2002 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Feb 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier for a semiconductor component is provided having passive components integrated in its substrate. The passive components include decoupling components, such as capacitors and resistors. A set of connections is integrated to provide a close electrical proximity to the supported components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.