Fast wafer positioning method for optical metrology
US7030984B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2003 |
| Grant date | Apr 18, 2006 |
| Priority date | — |
| Expiry date | Mar 28, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70616
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fast wafer positioning method for optical metrology includes three main steps. In the first step, an initial measurement recipe is constructed for the host system and target wafer. In the next step, the host system performs a test run using the initial measurement and the target wafer. In this step, the initial measurement recipe is refined to eliminate positioning errors produced by the host system. In the final step, the refined measurement recipe is used by the host system to process production wafers (e.g., as part of a production environment). This is performed using the information included in the refined measurement recipe without reference to optical images of the wafers being processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.