Electronic device having a plastic housing and components of a height-structured metallic leadframe and methods for the production of the electronic device

US7031170B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Frank Daeche · Unterhaching, DE
• Franz Petter · Markt Indersdorf, DE

Key dates

• Filing date: Sep 30, 2002
• Grant date: Apr 18, 2006
• Expiry date: Sep 28, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49172
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic device has a plastic housing. The plastic housing has components of a height-structured metallic leadframe. The components are in a matrix form and contain contact islands and chip islands on the underside of the plastic housing. Furthermore, the electronic device has a first line structure containing height-structured interconnects on the underside of the plastic housing and a second line structure containing bonding connections which are disposed within the plastic housing.