Semiconductor assembly with conductive rim and method of producing the same
US7034393B2 · kind B2 · utility
31Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2003 |
| Grant date | Apr 25, 2006 |
| Priority date | — |
| Expiry date | Dec 19, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S257/924
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An apparatus has first and second wafers, and a conductive rim between the first and second wafers. The conductive rim electrically and mechanically connects the first and second wafers. In addition, the conductive rim and second wafer at least in part seal an area on the surface of the first wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.