Immersion plating and plated structures
US7037559B2 · kind B2 · utility
1Cited by
15References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Dec 15, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12708
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A first metal is plated onto a substrate comprising a second metal by immersing the substrate into a bath comprising a compound of the first metal and an organic diluent. The second metal is more electropositive than the first metal. The organic diluent has a boiling point higher than a eutectic point in a phase diagram of the first and second metals. The bath is operated above the eutectic point but below the melting point of the second metal. For example, bismuth is immersion plated onto lead-free tin-based solder balls, and subsequently redistributed by fluxless reflow. Plated structures are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.