Stacked microelectronic devices and methods of fabricating same
US7037756B1 · kind B1 · utility
24Cited by
61References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2003 |
| Grant date | May 2, 2006 |
| Priority date | — |
| Expiry date | Jul 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Certain methods of the invention permit spacerless manufacture of stacked microelectronic devices by mechanically supporting a second microelectronic component with a wire coating. This wire coating may be sufficiently adhesive to also mechanically bond the second microelectronic component to a first microelectronic component. Other embodiments of the invention provide spacerless stacked microelectronic devices wherein a second microelectronic component is mechanically supported by a wire coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.