Method of fabricating flip chip ball grid array package
US7041531B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 22, 2004 |
| Grant date | May 9, 2006 |
| Priority date | — |
| Expiry date | Jul 22, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a flip chip ball grid array (FC-BGA) package is provided. First, a substrate including a first surface and a second surface is provided, wherein the first surface includes a plurality of cavities. Then, a plurality of flip chips is adhered in the cavities of the substrate. Thereafter, an underfill filling step is performed to fill an underfill between the substrate the flip chips. Then, a ball placement step is performed to attach a plurality of solder balls to a second surface of the substrate. Thereafter, the substrate is divided to separate a portion of the substrate adhering to the flip chips from a sidewall of the cavities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.