Cleaning a component of a process chamber
US7045020B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2003 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Oct 13, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/905
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Process deposits formed on a component of a process chamber are cleaned. In the cleaning method, gas holes in the component are mechanically pinned to clean the process deposits therein. A ceramic portion of the component is then exposed to an acidic solution, such as a solution of hydrofluoric acid and nitric acid. Mechanical pinning of the gas holes may be repeated after the acid cleaning step. The component is then plasma stabilized in a plasma zone by introducing a non-reactive gas into the plasma zone and forming a plasma of the non-reactive gas in the plasma zone. In one version, the component comprises an electrostatic chuck comprising a ceramic covering an electrode and having the gas holes therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.