Electronic component with shielding and method for its production
US7045881B2 · kind B2 · utility
6Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2001 |
| Grant date | May 16, 2006 |
| Priority date | — |
| Expiry date | Apr 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component with shielding is described. The component has a semiconductor chip with a semiconductor substrate. Disposed in a region of a rear side of the semiconductor substrate is an electrically conductive buried layer. The buried layer is connected via a ground lead, disposed within the semiconductor substrate, to a contact area and an external ground potential. Furthermore, the invention relates to a method for producing an electronic component of this type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.