Method for producing a contact substrate and corresponding contact substrate
US7049213B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 22, 2002 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | May 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a method for producing a contact substrate (10) as well as to a contact substrate with through-plating between a connector arrangement (21) arranged at the top of a dielectric carrier substrate (12) and the underside of the carrier substrate, wherein the connector arrangement extends along an aperture margin (22) of a substrate recess (15), and the underside (11) of the carrier substrate (12) is supported by a backstop (23), wherein a formed solder material part (24) is placed in the substrate recess (15), and in a subsequent method-related step said formed solder material part (24) is deformed within the substrate recess so as to form a formed contact part (50), such that radial displacement of the material of the formed solder material part in the substrate recess results in a non-positive connection between an intrados surface (28) of the substrate recess and the connector arrangement (21), and that the formed contact part provides through-plating between the connector arrangement (21) and the underside (11) of the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.