Thermal treatment equipment and thermal treatment method
US7050710B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2002 |
| Grant date | May 23, 2006 |
| Priority date | — |
| Expiry date | Oct 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat treatment apparatus configured to perform heat treatment on a wafer having a surface on which a coating film is formed, and includes: a holding member for holding the wafer almost horizontally; a chamber for housing the wafer held by the holding member; a hot plate having gas permeability and disposed above the wafer held by the holding member in the chamber so that the coating film formed on the wafer can be directly heated; and an exhaust port provided on the top face of the chamber and exhausting gas in the chamber. Gas generated from the coating film passes through the hot plate and is exhausted from the chamber. Accordingly, uniformity of a coating film is improved. As a result, CD uniformity may be improved, LER characteristics may be improved, and a smooth pattern side face may be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.