Chemical-mechanical polisher hardware design
US7052372B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2001 |
| Grant date | May 30, 2006 |
| Priority date | — |
| Expiry date | Feb 19, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polish apparatus for planarizing wafers and films over wafers comprising the following. A substrate chuck for holding a substrate with a surface to be polished thereof being directed about vertically. A first drive means for rotating the substrate chuck. A polishing head having a polishing surface which is adjacent to the substrate during the polishing of the substrate. The polishing surface of the polishing head is smaller than the surface of the substrate. A polishing solution supply means for supplying a polishing solution through the polishing head to the substrate held by the substrate chuck. A reciprocating means for reciprocally moving the polishing head on the surface to be polished. A pressing means for pressing the polishing pad against a substrate held by the substrate chuck by way of the polishing head. The polish head is preferably comprised of one piece of molded polymer. No polish pad is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.